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Krunter Future Tech (Dongguan) Co., Ltd.

Krunter Future Tech. (Dongguan) Co., Ltd.

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Home / Products / Bend PIN / BeCu C17200 Bend PIN 0.25mm Thickness Au Plating Lightweight /

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BGA Test Socket Housing Machining

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Krunter Future Tech (Dongguan) Co., Ltd.
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BeCu C17200 Bend PIN 0.25mm Thickness Au Plating Lightweight
BeCu C17200 Bend PIN 0.25mm Thickness Au Plating Lightweight
  • BeCu C17200 Bend PIN 0.25mm Thickness Au Plating Lightweight
  • BeCu C17200 Bend PIN 0.25mm Thickness Au Plating Lightweight
  • BeCu C17200 Bend PIN 0.25mm Thickness Au Plating Lightweight
  • BeCu C17200 Bend PIN 0.25mm Thickness Au Plating Lightweight
  • BeCu C17200 Bend PIN 0.25mm Thickness Au Plating Lightweight
  • BeCu C17200 Bend PIN 0.25mm Thickness Au Plating Lightweight
Products Detailed
Bend PIN for BeCu C17200 Material 0.25mm Thickness Au Plating All Sizes are in mm Material: BeCu C17200 3/4H Au plating:thickness 3um,contains 0...
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